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May 2005

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TechNet E-Mail Forum <[log in to unmask]>, MattyK <[log in to unmask]>
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Tue, 10 May 2005 20:13:42 GMT
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yes it usually is 80%, though when the ball gets to .60mm diameter + it's 75%

-- Eddie Rocha <[log in to unmask]> wrote:
If you're interested I have some routing guidelines for BGA's of
1mm,  .8mm,  and  .5mm pitches.

On 10 May 2005 at 11:59, John Guy wrote:

Hello All,
        I was wondering if there is some guideline for the
recommended pad size for a BGA based on the component's ball
size?  I have been told that it is recommended that the pad diameter
be about 80% of the ball diameter, but I would like some
confirmation.

Thanks in advance,
John Guy
Surface Mount Process Engineer
diversifiedsystems, inc.
Custom Products Division
3939 W. 56th Street
Indianapolis, IN 46254-4961

Telephone: 317-299-9547, x336
Fax: 317-298-2055
E-mail: [log in to unmask]
Web: www.divsys.com

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-- Thanks,
Eddie Rocha
South Bay Circuits
(480) 940-3125 x122

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