Hello All,
        I was wondering if there is some guideline for the recommended pad size for a BGA based on the component's ball size?  I have been told that it is recommended that the pad diameter be about 80% of the ball diameter, but I would like some confirmation.

Thanks in advance,
John Guy 
Surface Mount Process Engineer
diversifiedsystems, inc. 
Custom Products Division
3939 W. 56th Street
Indianapolis, IN 46254-4961

Telephone: 317-299-9547, x336
Fax: 317-298-2055
E-mail: [log in to unmask] 
Web: www.divsys.com

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