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May 2005

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Subject:
From:
Al Onderick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 3 May 2005 10:40:29 -0500
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text/plain
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text/plain (35 lines)
Greetings Tech netters,



            In the past we've had problems with tented vias not completely
tenting and trapping liquid.  The liquid would boil and find its way to
the surface of the board.



While this looks similar these vias were not tented.





http://www.texas-gold.org/PCB/



Al Onderick

National Instruments


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