sounds might be insufficient heat. The ground may sink more heat than the
other pin upon reflow. either it is a lousy design or you might want to
change profile to get complete reflow of the ground pin....Large board?
make sure you do not over reflow the other components if you want to put
more heat.... (someone may not do a DFM well)...
jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of John Burke
Sent: Monday, May 09, 2005 5:23 PM
To: [log in to unmask]
Subject: Re: [TN] Suggested failure analysis technique?
What is over the top of the nickel??
You can't be soldering straight to nickel.............it will be oxidised.
John
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Cheryl Tulkoff
Sent: Monday, May 09, 2005 2:11 PM
To: [log in to unmask]
Subject: Re: [TN] Suggested failure analysis technique?
Board finish is Cu with OSP. The cracks only show up on the ground pins and
not the signal pin. I'd only get an electrical fail if the center joint
cracked completely.
Thanks,
Cheryl Tulkoff
Phone:(512) 683-8586
Fax: (512) 683-8847
National Instruments
11500 N. Mopac Expressway
Building A
Austin, TX 78759-3504
Vladimir Igoshev
<[log in to unmask]
> To
Sent by: TechNet [log in to unmask]
<[log in to unmask]> cc
Subject
05/09/2005 03:56 Re: [TN] Suggested failure analysis
PM technique?
Please respond to
TechNet E-Mail
Forum
<[log in to unmask]>
; Please respond
to
Vladimir Igoshev
<[log in to unmask]
>
Hi Cheryl,
Unfortunately, it doesn't seem to exist. Particularly with hairline cracks
where electrical contact could be present. What is the finish on your
boards?
Regards,
Vladimir
Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Cheryl Tulkoff
Sent: Monday, May 09, 2005 4:46 PM
To: [log in to unmask]
Subject: [TN] Suggested failure analysis technique?
I have a large lot of circuit boards where about 20% have small, hairline
solder fractures around some wave soldered PTH connector joints. We're
working on root cause analysis to prevent it from happening and repairing
the boards which have failed inspection. But, we're tying to figure out
what to do with the boards that have passed the inspection but may be at
risk. Quick and dirty tests have been unable to create fractures on these
joints and they pass visual criteria. Are there any quantitative tests
that could be performed on a sample to verify solder joint integrity? We
don't hae any historical data for comparison.
Thanks! Cheryl
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