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May 2005

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Mon, 9 May 2005 14:23:24 -0700
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text/plain (161 lines)
What is over the top of the nickel??

You can't be soldering straight to nickel.............it will be oxidised.

John

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Cheryl Tulkoff
Sent: Monday, May 09, 2005 2:11 PM
To: [log in to unmask]
Subject: Re: [TN] Suggested failure analysis technique?


Board finish is Cu with OSP. The cracks only show up on the ground pins and
not the signal pin. I'd only get an electrical fail if the center joint
cracked completely.

Thanks,
Cheryl Tulkoff
Phone:(512) 683-8586
Fax: (512) 683-8847
National Instruments
11500 N. Mopac Expressway
Building A
Austin, TX 78759-3504





             Vladimir Igoshev
             <[log in to unmask]
             >                                                          To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>                                          cc

                                                                   Subject
             05/09/2005 03:56          Re: [TN] Suggested failure analysis
             PM                        technique?


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
             Vladimir Igoshev
             <[log in to unmask]
                     >






Hi Cheryl,

Unfortunately, it doesn't seem to exist. Particularly with hairline cracks
where electrical contact could be present. What is the finish on your
boards?

Regards,

Vladimir

Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2

Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Cheryl Tulkoff
Sent: Monday, May 09, 2005 4:46 PM
To: [log in to unmask]
Subject: [TN] Suggested failure analysis technique?


I have a large lot of circuit boards where about 20% have small, hairline
solder fractures around some wave soldered PTH connector joints. We're
working on root cause analysis to prevent it from happening and repairing
the boards which have failed inspection. But, we're tying to figure out
what to do with the boards that have passed the inspection but may be at
risk. Quick and dirty tests have been unable to create fractures on these
joints and they pass visual criteria. Are there any quantitative tests
that could be performed on a sample to verify solder joint integrity? We
don't hae any historical data for comparison.

Thanks! Cheryl

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