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May 2005

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir Igoshev <[log in to unmask]>
Date:
Mon, 9 May 2005 16:56:33 -0400
Content-Type:
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Hi Cheryl,

Unfortunately, it doesn't seem to exist. Particularly with hairline cracks where electrical contact could be present. What is the finish on your boards?

Regards,

Vladimir

Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2

Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Cheryl Tulkoff
Sent: Monday, May 09, 2005 4:46 PM
To: [log in to unmask]
Subject: [TN] Suggested failure analysis technique?


I have a large lot of circuit boards where about 20% have small, hairline
solder fractures around some wave soldered PTH connector joints. We're
working on root cause analysis to prevent it from happening and repairing
the boards which have failed inspection. But, we're tying to figure out
what to do with the boards that have passed the inspection but may be at
risk. Quick and dirty tests have been unable to create fractures on these
joints and they pass visual criteria. Are there any quantitative tests
that could be performed on a sample to verify solder joint integrity? We
don't hae any historical data for comparison.

Thanks! Cheryl

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