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May 2005

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Subject:
From:
Gary Camac <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gary Camac <[log in to unmask]>
Date:
Fri, 20 May 2005 11:07:11 -0500
Content-Type:
text/plain
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text/plain (87 lines)
I think Gabriela might have it.  If you heat up one of these joints with
a soldering iron does the solder bubble when the it is molten?  If so, I
would definately want to do a cross-section.

Gary Camac

Gabriela Bogdan wrote:

>May be thin copper plating and platig voids+outgassig  . A cross section
>should be done to verify the hole plating quality.
>Is this a double sided or multilayer board?
>Did you experience opens before deciding to X-ray the board?
>Are the failed boards from the same manufacturer and date code?
>Gaby
>----- Original Message -----
>From: "Al Onderick" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Thursday, May 19, 2005 8:54 PM
>Subject: [TN] XRAYed through holes ??
>
>
>
>
>>Technetters, Any idea what might cause this? The SMT soldered fine, but
>>the thru holes look like this
>>
>>
>>
>>http://www.texas-gold.org/PCB/pages/xray/index.htm
>>
>>
>>
>>-Al Onderick
>>
>>
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