Thanks so much for the information everyone!
Does anyone have any experience with the difference in the
actual solder joints between SAC and SnCu(Ni)?
I have heard that the SAC alloy can have voids and bubbles
in the solder joints and that the SnCu(Ni) does not have
the voids. Is this true?
Is the higher temperature really a problem when wave soldering with the SnCu(Ni)?
Soldering is not my field, but I have to go to a meeting on Monday
to discuss which solder we should fill the wave machine, and I would
like everyone's opinion.
Thank you again.
Kaye Clayo
Sr. P. C. Layout Designer
At 03:09 AM 5/13/2005, you wrote:
>Kaye
>
>It's a matter of cost. SAC alloys can be well used in wave soldering at
>almost the same wave temperature as SnPb but ist more expensive than
>SnPb. SnCu(Ni) is cheaper than SAC with the drawback of higher
>temperature plus having another alloy in the wave joints than in the
>reflow joints.
>
>Best regards
>
>Guenter
>
>
>
>EMPA
>Swiss Federal Laboratories for Materials Testing and Research
>Centre for Reliability
>Guenter Grossmann, Senior Engineer
>
>8600 Duebendorf
>Switzerland
>
>Phone: xx41 1 823 4279
>Fax : xx41 1 823 4054
>mail: [log in to unmask]
>
>>>> [log in to unmask] 10.05.2005 19:19:59 >>>
>Technet,
>
>Can anyone share what the differences are between
>Tin-Silver-Copper (SAC) solder and the Tin-Copper-Nickle solder
>(or ultimately, the solder joints) for use in wave solder machines?
>Why would someone want to use one over the other?
>
>Thanks,
>
>Kaye
>
>
>
>
>
>
>
>
>
>
>
>
>
>
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