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May 2005

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Subject:
From:
Mark Austin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mark Austin <[log in to unmask]>
Date:
Wed, 4 May 2005 09:34:00 +0100
Content-Type:
text/plain
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text/plain (57 lines)
Are these boards Immersion Tin? We had a similar problem with some Tin PCB's
where the Tin chemistry was being left behind in the tented vias and then
erupting during reflow. Check with PCB supplier.

Mark

===== Original Message from [log in to unmask] (TechNet E-Mail Forum) at
3/05/05 16:40
>Greetings Tech netters,
>
>
>
>            In the past we've had problems with tented vias not completely
>tenting and trapping liquid.  The liquid would boil and find its way to
>the surface of the board.
>
>
>
>While this looks similar these vias were not tented.
>
>
>
>
>
>http://www.texas-gold.org/PCB/
>
>
>
>Al Onderick
>
>National Instruments
>
>
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