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May 2005

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Subject:
From:
Mark Hargreaves <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 20 May 2005 11:17:24 -0400
Content-Type:
text/plain
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text/plain (24 lines)
Hi All,

We lead/tin plate our boards prior to etch, then strip the lead/tin off
prior to soldermask application & ENIG surface finish (SMOBC).
I'm wondering if we must, might, or won't have to switch to a Tin (or
alternative) plating bath to meet RoHS requirements.
a. Does lead/tin strip invariably leave a (RoHS significant) lead residue on
the copper?
b. Is RoHS concerned with lead in the process & product, or just the end
product?

Any thoughts?

Thanks,
Mark

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