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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Fri, 20 May 2005 11:17:24 -0400 |
Content-Type: | text/plain |
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Hi All,
We lead/tin plate our boards prior to etch, then strip the lead/tin off
prior to soldermask application & ENIG surface finish (SMOBC).
I'm wondering if we must, might, or won't have to switch to a Tin (or
alternative) plating bath to meet RoHS requirements.
a. Does lead/tin strip invariably leave a (RoHS significant) lead residue on
the copper?
b. Is RoHS concerned with lead in the process & product, or just the end
product?
Any thoughts?
Thanks,
Mark
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