Hello,
What is the best lab. method to 'precisely' determine the composition of
lead free solder balls of unassembled LF area array components like CSP
or BGA?
It is my understanding that ICP-AES requires a great amount of material
(1g) and cannot apply to a single package.
How do the component manufacturers proceed for their material
declarations about LF solder balls?
Best regards,
A. Grivon
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