Oops. I should have changed the subject line in my previous email. Sorry
folks!

Best Regards,

Randy Buchter
Product Design Manager
Ranoda Electronics


----- Original Message -----
From: "R Buchter" <[log in to unmask]>
To: "(Leadfree Electronics Assembly Forum)" <[log in to unmask]>
Sent: Tuesday, May 31, 2005 3:23 PM
Subject: Re: [LF] PN's changing


> Hello All,
>
> We have encountered a concern with a lead free stamped part. It is
stainless
> steel base metal with 1.27micrometers minimum nickel underplate and 2.54
> micrometers minimum matte tin overplate. The plastic is LCP.
>
> After reflow, the matte tin has a yellowish color.
>
> What could this be and how can it be avoided? Is high solder temperature
> causing this? Does the stainless steel have something to do with it, as
> copper alloy contacts with similar platings do not appear to have this? Is
> the LCP a factor?
>
> Thanks in advance!
>
> Best Regards,
>
> Randy Buchter
> Product Design Manager
> Ranoda Electronics
>

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------