Hello All,

We have encountered a concern with a lead free stamped part. It is stainless
steel base metal with 1.27micrometers minimum nickel underplate and 2.54
micrometers minimum matte tin overplate. The plastic is LCP.

After reflow, the matte tin has a yellowish color.

What could this be and how can it be avoided? Is high solder temperature
causing this? Does the stainless steel have something to do with it, as
copper alloy contacts with similar platings do not appear to have this? Is
the LCP a factor?

Thanks in advance!

Best Regards,

Randy Buchter
Product Design Manager
Ranoda Electronics

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