In collecting data for RoHS and lead-free changeover, we are being

offered data which give MSL ratings and max reflow temperatures for

through-hole parts. Now I know that for those using PIHR/PIP soldering

this is vital, but my question is whether this data is valid since

J-STD-020 only strictly applies to SMT parts (and really only

solid-state devices too, if you want to be really pedantic.) Often on

the datasheets there seems to be some confusion about wave soldering

temperatures and reflow profiles and so the data is always a bit

dubious.



Does anyone know if/when IPC-9503 is due to be updated for Pb-free

soldering to bring it in line with J-STD-020?





Nigel Burtt

Production Engineering Manager

Dolby Labs Inc - European HQ

Email: mailto:[log in to unmask]

Tel:     +44 (0)1793 842132 [direct line with voicemail] 

Fax:    +44 (0)1793 842101





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