EMBEDDEDNET Archives

May 2005

EmbeddedNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Teleconference of D-54 Embedded Component Test Method Subcommittee
From:
Tom Newton <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, Tom Newton <[log in to unmask]>
Date:
Thu, 12 May 2005 11:25:37 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (46 lines) 
Reminder:  The D-54 Subcommittee will hold its teleconference today:
Thursday, May 12 at 3:00 pm CDT.

  

[Please Note:  The Minutes from the last teleconference of the D-54
incorrectly stated May 19.]   

 

The access details are:  

Call-In Connection: 1-620-584-8200 and the PIN: 54687#

 

Agenda for Conference Call on May 12, 2005

 

1. Discussion on Test Method, Draft 2 of TM 2.5.7.2, (DC) Withstanding
Voltage as posted on the D-54 Subcommittee Home Page.  No comments have
been received on this posted version, so please plan to bring your
comments to this teleconference for insertion into this draft.

 

2. Any comments on the Reliability requirements for the IPC-4821
Capacitance Material specification.

 

3. Any comments on the Temperature Coefficient of Capacitance (TCC)
testing called out in the IPC-4821.

 

4. Other test method comments for the D-50 Committee's (D-51 through
D-53) activities.   

 

 

 

ATOM RSS1 RSS2