Colleagues,

 

A quick reminder that the IPC D-51 Embedded Devices Design Subcommittee
meets this Thursday, May 26th at 4PM Eastern, 1PM Pacific.  The dial-in
number is 1-620-584-8200 and the passcode is 89542#

 

There are 3 new files available at the D-51 detail page for this
meeting, located at
http://www.ipc.org/committeedetail.asp?Committee=D-51

 

1) A copy of MIL-R-10509 for film resistors

2) A summary of the short time overload requirement for resistors within
MIL-R-10509

3) An updated copy of the IPC-2316 design guide.

 

Listed below is the action item status from the 04/21/05 teleconference.

 

Regards,

 

John Perry

Technical Project Manager

IPC

[log in to unmask]

1-847-597-2818 (P)

 

4.1.3, Temperature Coefficient of Resistance - Bob Croswell of Motorola
to draft paragraph addressing carbon resistors.

 

Figure 4-2, Power Dissipation - Richard Snogren of Bristlecone to
contact Percy Chinoy of Rohm and Haas Electronic Materials for units of
measure along the x-axis. Action item completed 05/24/05 by Percy Chinoy
(submission of replacement figure).

 

4.1.5, STOL and 4.1.6, Standard Working Voltage - Snogren to contact
Gould regarding these two sections. Action item completed 05/24/05 -
obtained information from MIL-R-10509.

 

4.1.7, ESD - Croswell to evaluate need for any additional editing of
this section.

 

4.2, General Process Design Guidelines - Snogren to replace all
instances of "pad" with "land". Action item completed 05/24/05.

 

4.2.1, Placement and Registration of Embedded Resistors, and 4.2.2, Thin
Film Additive Resistor Dimenions -  Dave Swoska of MacDermid to
consolidate these two sections into a single section 4.2.1. Action item
completed 05/13/05 by Dave Swoska and Colleen McKirryher.

 

4.3.1, Additive Techniques, Thick Film - Snogren to edit this section.
Follow on action is a proposal to have subcommittee review this section
for editing of language and style (taken from Motorola technical paper)
to match the rest of the guideline document.

 

4.3.2, Additive Techniques, Thin Film - Colleen McKirryher and Don
Cullen, MacDermid, Inc. to edit this section. - Action item completed
05/13/05 - review made and no edits required.

 

4.3.3, Subtractive Techniques, Thick Film - Dave McGregor, DuPont
Company to edit this section.

 

4.3.4, Subtractive Techniques, Thin Film -Cullen to edit this section.

 

4.4, Test and Trim - Kim Fjeldsted, Ormatech to edit this section,
including 4.4.3 on additive ink jet with assistance from Virang Shah of
Microfab Technologies, Inc.

 

Richard to solicit review of 4.3.4 from Rocky Hilburn, Sid Clouser and
Dan Brandler.  Sid many no longer be with Gould.  Kim will go after
Rocky and Jing Tau @ Gould while Richard will go after Dan Brandler and
Percy Chinoy.