Subject: | |
From: | |
Reply To: | |
Date: | Thu, 5 May 2005 10:11:17 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hello All,
I'm looking for some guidance.
My understanding into the fabrication process is limited
to the following:
Etching: For every oz. down, the feature will be etched back the same
amount. What I'm not sure about is how much additional clearance is required
between the features for the etching process.
I hope that someone can educate me in this area, articles, books,
experience, etc..
The information will be used for determining what the max copper weight
is that a footprint
can be placed on.
Regards,
Buck
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|