Hello All,
I was wondering if there is some guideline for the recommended pad size for a BGA based on the component's ball size? I have been told that it is recommended that the pad diameter be about 80% of the ball diameter, but I would like some confirmation.
Thanks in advance,
John Guy
Surface Mount Process Engineer
diversifiedsystems, inc.
Custom Products Division
3939 W. 56th Street
Indianapolis, IN 46254-4961
Telephone: 317-299-9547, x336
Fax: 317-298-2055
E-mail: [log in to unmask]
Web: www.divsys.com
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