Most shops can handle via in pad but I can see that this is adding cost
for not benefit layout.  The cost factors can be large and the actual
number depends on the board mechanics.

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: Allen T. Maddox [mailto:[log in to unmask]] 
Sent: Wednesday, May 18, 2005 10:43 AM
To: [log in to unmask]
Subject: [TN] Via in (SMT) pad

We have a couple engineers who are insisting on using Via in (SMT) pad.
I'm not talking about micro via in a BGA pad. I'm talking about vias
with a 10 to 28 mil hole in a 0805, PLCC, QFP, and other SMT pad.
In order for this to work in manufacturing they must be filled, without
voids, and capped flush on the solder surface.
Does anyone know of a board house that does this process?

Would you have an idea what the general cost effect to a board for this
process and does it make a difference if it's one via or 500 vias? Cost
difference between electrically conductive and thermally conductive
fill?
 
Any information would be helpful,
 
 
Allen Maddox C.I.D.
Sr. PC Board Designer
GAI-Tronics, Corp
610-796-5854
PO Box 1060
Reading, PA 19607-1060
 
[log in to unmask]
www.gai-tronics.com


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