Hi All...

Boy, I hope your day is going better than mine...

One of my inspectors called me to to look at an assembly she had. I
came to her station and started looking at the assembly, and just about
cried (not really). I observed something that I've seen before...

The solder mask is losing adhesion from all copper features, traces, vias,
everything copper. This starts occuring after about 2-3 wash cycles in our
batch cleaner. Take a look at; "Mask Bubble, Mask Bubble 2, 3, and 4", at:
http://www.stevezeva.homestead.com

I've seen this before and thought we had the problem taken care of. It's
caused
by the chemistry we use to clean RMA flux residues, not being compatible
with
certain dryfilm solder masks. We use Kyzen Aquanox 4512P in the
manufacturers
recommended concentration, and we see this problem everytime a Dynachem
Dynamask (now Shipley) dry film is used. We used to use Aquanox XJN and had
the same problem.

On our PO's we have a note that when dry film solder mask is called out on
the fab
drawing, use Dupont Vacrel series dry films, as we know that we have
absolutely no
problem with Vacrel.

The last time I had this problem and posted about it, there were a few
responses that
I shouldn't be having these problems, that the Dynachem Dynamask dry films
are very
robust. But I swear, everytime I see the mask bubbling and flaking like you
see in the
images I've posted, it turns out that a Dynachem dry film was used.

Can I be the only one that has these probelms?

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
__________________________________________________________________
This message may contain information that is privileged and confidential to
LaBarge, Inc.  It is for use only by the individual or entity named above.
If you are not the intended recipient, you may not copy, use or deliver
this message to anyone.  In such event, you should destroy the message and
kindly notify the sender by reply e-mail.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------