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April 2005

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Subject:
Re: SMT solder joints / % voids allowed
From:
Linda Langley <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Linda Langley <[log in to unmask]>
Date:
Fri, 8 Apr 2005 11:45:06 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (53 lines) 
IPC - 610, page 12-86

Linda Langley
Training Specialist
Jabil Circuit Inc.
Auburn Hills, Michigan
(248) 292-6176 

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]
Sent: Friday, April 08, 2005 10:53 AM
To: [log in to unmask]
Subject: [TN] SMT solder joints / % voids allowed


Hi T'Netter's;

I'm trying to track down specific numbers regarding the maximum allowable
percentage of voids in a Surface Mount solder joint.
I'm not looking for the BGA criteria, but what is allowed for the
"standard" SMT components.
Looking through IPC-A-610D, I can't seem to identify any specific sections
yet.

Any and all help is appreciated.
TIA.
Reards,
Rob

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