Hi T'Netter's;
I'm trying to track down specific numbers regarding the maximum allowable
percentage of voids in a Surface Mount solder joint.
I'm not looking for the BGA criteria, but what is allowed for the
"standard" SMT components.
Looking through IPC-A-610D, I can't seem to identify any specific sections
yet.
Any and all help is appreciated.
TIA.
Reards,
Rob
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