Happy Friday, Technetters!

OK, now that I've gotten your attention, our Engineering folks have been trying to drag the manufacturing folks (kicking and screaming) into the 21st century (or maybe even just the 20th century) in terms of manufacturing capabilities. We are a low volume high mix OEM, with limited SMT capabilities. The R&D guys want to use the more sophisticated stuff, but the old equipment we have just isn't up to the task. We struggle with 208pin QFPs and other high density devices. They would like to use smaller components, and possibly even BGAs. 

I know for smaller components we would have to upgrade to a better pick and place machine with more accurate component placement. But for BGAs, the existing machine may be able to place them, but currently we have no way to tell how well it worked, other than whether it passed or failed functional test. 

I've seen the "look-under" BGA inspection equipment, but I believe that we would probably need the X-ray machine to do the job. I've also heard that our old reflow oven may not even do a good job at reflowing BGAs. 

Is X-ray inspection necessary? And will any old reflow oven solder a BGA? 

Thanks,

Blair

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