I think using a release film would do what you want
-----Original Message-----
From: Leo Higgins [mailto:[log in to unmask]]
Sent: Wednesday, April 06, 2005 7:12 PM
To: [log in to unmask]
Subject: Re: [TN] Etching resin coated copper (RCC)
I should have been more clear. The issue I was thinking about was the
proper transfer of pressure to the resin exposed by Cu etch-off. How
could
this exposed resin be made to adhere well to the underlying substrate,
without sticking to a conformal layer placed on the top of the RCC?
Best regards,
Leo
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
The information contained in this electronic message is
CUSTOMER/SUPPLIER
PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the
individual or entity named above. If the reader of this message is not
the
intended recipient, you are hereby notified that any dissemination,
distribution and copying of this communication is strictly prohibited.
If
you have received this communication in error, please immediately notify
the
sender by electronic mail. Thank you.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Leo Higgins
Sent: Wednesday, April 06, 2005 5:25 PM
To: [log in to unmask]
Subject: Re: [TN] Etching resin coated copper (RCC)
Even if the resin layer was not contaminated/modified, perhaps the
adhesive
in the areas where copper was removed would not bond well to underlying
surface?
Best regards,
Leo
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
The information contained in this electronic message is
CUSTOMER/SUPPLIER
PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the
individual or entity named above. If the reader of this message is not
the
intended recipient, you are hereby notified that any dissemination,
distribution and copying of this communication is strictly prohibited.
If
you have received this communication in error, please immediately notify
the
sender by electronic mail. Thank you.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jeffrey Bush
Sent: Tuesday, April 05, 2005 2:37 PM
To: [log in to unmask]
Subject: Re: [TN] Etching resin coated copper (RCC)
I will submit that the absorption of chemistry and copper will affect
the rheology of the material. Poor cross-linking into the c-stage could
also affect performance - adhesion, dielectric properties, thickness,
etc. Testing this would not be costly and may present some findings as
a function of your specific design, base materials, application,.....
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: R Sedlak [mailto:[log in to unmask]]
Sent: Tuesday, April 05, 2005 3:13 PM
To: [log in to unmask]
Subject: Re: [TN] Etching resin coated copper (RCC)
I am convinced that Colin has hit it spot on the money, B Stage is
reactive, and will almost certainly react with Copper, and absorb it.
Perhaps a key question is, does this matter?
Rudy Sedlak
RD Chemical Company
Colin McVean <[log in to unmask]> wrote:
I would be concerned about the possibility of contamination into the
resin with etching solutions, which may stain and change properties etc
which will then be bonded onto a sub-assembly
If your talking about a single stage "B" stage with around 50-80uM of
resin, there may be handling issues, as the material is not as "solid"
and flexible as it would be after the change in rheology excursion
through the press. A 2 stage "B" and "C" may be more suitable for
handling, but the same concern refers as above to the "B" stage.
Colin McVean
Production Manager
Artetch Circuits Limited
Tel: 01903 725365
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James W. High
Sent: 05 April 2005 16:35
To: [log in to unmask]
Subject: [TN] Etching resin coated copper (RCC)
RCC is a copper foil coated with B-staged epoxy resin. Is it possible
to
etch a pattern in the copper while the epoxy is still in the B-stage?
In
other words, will the chemical etchant attack the as yet not fully cured
epoxy? If anyone has actual experience doing this, please let me know.
Thank you,
James High
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------
Do you Yahoo!?
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
Yahoo! Sports - Sign up for Fantasy Baseball.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
