I occasionally see OL copper thickness specs where the finished thickness is
called out in ounces of copper.  For instance, 0.5 oz foil plated up to 2.0
oz.  I'm not sure how to interpret this.

The nominal thickness for 2.0 oz of copper comes out to be something like
2.75 mils (70 microns).  But the 2 oz copper I use to build the boards
doesn't come to me that thick and only needs to be 2.2 mils or 56 um by the
time I'm done with it.

Surely, I'm not the only one to see this.  How are others treating this?  Do
you try to plate to 70 ums but accept 56 um as the minimum?  Or is 70 um the
minimum?

Is there any industry standard anywhere that covers copper plating thickness
in this method?



Follow the copper foil road.....

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