Yes there is a name for it but I forgot, it is sometimes seen in enig
systems where you can get apparently random gold specs on the surface of the
board. I believe someone will enlighten us on the name for it...........I am
at home otherwise I would look it up.
John
-----Original Message-----
From: R Sedlak [mailto:[log in to unmask]]
Sent: Saturday, April 30, 2005 11:59 AM
To: TechNet E-Mail Forum; John Burke
Subject: ENIG-Skip plating
The "skip plating" you are referring to is a lack of plating where you
wanted it?
Is there a common name for plating occurring where you do NOT want it...?
How common is this problem?
Rudy Sedlak
RD Chemical Company
John Burke <[log in to unmask]> wrote:
I actually developed a test panel to trigger skip plating at various hole
sizes/aspect rations, it is designed to find the "edge" of the fluid
dynamics of the particular bare process. The test panel allows you to assess
the line capability for high aspect ratio , thick board - small via boards,
but like I said before you need to understand whether you are working with a
skip plate problem OR a straight black pad chemistry issue.
John
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Vladimir Igoshev
Sent: Friday, April 29, 2005 11:17 AM
To: [log in to unmask]
Subject: Re: [TN] gold vs copper plating on pcb's - Black PAD???
If it's not the worst-worst case when the IPC test would work, then I'd say
no. If one knew how to do it, then the person would be pretty rich, I guess.
:-)
Vladimir
Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kanaiyalal Patel
Sent: Friday, April 29, 2005 1:34 PM
To: [log in to unmask]
Subject: Re: [TN] gold vs copper plating on pcb's - Black PAD???
Vladimir and others,
Are you saying that I may not be able to find out
black pad condition on fab before relfow?
re,
Ken Patel
--- Vladimir Igoshev wrote:
> Yes, after reflow.
> Regards,
> Vladimir
> Sent from my Blackberry Wireless
> Vladimir Igoshev, 519-888-7465 ext.5283
>
>
> -----Original Message-----
> From: TechNet
> To: [log in to unmask]
> Sent: Fri Apr 29 12:17:00 2005
> Subject: Re: [TN] gold vs copper plating on pcb's -
> Black PAD???
>
> All,
> How is to detect black pad? Can it be inspected at
> PCB
> level? I guess no. Is it the after reflow soldering
> phenomena?
>
> Re,
> Ken Patel
>
>
> --- Werner Engelmaier wrote:
> > Hi Bob,
> > First, with ENIG you do not solder to gold, but to
> > the underlying nickel;
> > Second, soldering to Ni requires more thermal
> > energy, thus higher temperatures, and that is
> really
> > bad news on top of the T-increase necessary for
> > LF-solders;
> > Third, the 'black pad' issue will not go away with
> > LF-solderas,but actually may become worse.
> > Thus, Immersion Ag is a good choice.
> > Werner Engelmaier
> >
> > -----Original Message-----
> > From: Jeffrey Bush
> > To: [log in to unmask]
> > Sent: Wed, 27 Apr 2005 07:14:42 -0400
> > Subject: Re: [TN] gold vs copper plating on pcb's
> >
> >
> > If you stick with ENIG and do not test Immersion
> > Silver then I am sure
> > you will be doing future testing to combat the
> > issues with ENIG. Monies
> > are being put into the development if silver and
> > several toughed
> > formulas are coming out that have excellent
> > resistance to TC and do not
> > have the issues associated with ENIG. OSP is also
> > seeing some
> > development, but I do not see this as a viable
> > alternative today.
> >
> > Jeffrey Bush
> > Director, Quality Assurance and Technical Support
> >
> > VERMONT CIRCUITS INCORPORATED
> > 76 Technology Drive - POB 1890
> > Brattleboro, Vermont 05302
> > Voice: 802.257.4571.21 Fax: 802.257.0011
> > http://www.vtcircuits.com
> >
> >
> > -----Original Message-----
> > From: Bob Arciolla [mailto:[log in to unmask]]
> > Sent: Tuesday, April 26, 2005 4:41 PM
> > To: [log in to unmask]
> > Subject: [TN] gold vs copper plating on pcb's
> >
> > Good Afternoon all,
> >
> > Our company will be switching over to lead free
> and
> > we have received
> > sample pcb's from one of our vendors and one board
> > has gold (ENIG) for
> > the traces and one has copper (OSP). From some of
> > the emails I have seen
> > on Technet it appears that gold is what most of
> > companies are going to
> > be using? Is this correct or is there some other
> > materials we should be
> > looking into to use? Is the gold more reliable
> than
> > the copper?
> > Any input would be greatly appreciated.
> >
> >
> >
> ---------------------------------------------------
> > Technet Mail List provided as a service by IPC
> using
> > LISTSERV 1.8e
> > To unsubscribe, send a message to [log in to unmask]
> > with following text
> > in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt or (re-start) delivery of
> > Technet send e-mail to
> > [log in to unmask]: SET Technet NOMAIL or (MAIL)
> > To receive ONE mailing per day of all the posts:
> > send e-mail to
> > [log in to unmask]: SET Technet Digest
> > Search the archives of previous posts at:
> > http://listserv.ipc.org/archives
> > Please visit IPC web site
> > http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for
> > additional
> > information, or contact Keach Sasamori at
> > [log in to unmask] or 847-615-7100
> > ext.2815
> >
>
-----------------------------------------------------
> > Regards, Bob
> >
> >
> ---------------------------------------------------
> > Technet Mail List provided as a service by IPC
> using
> > LISTSERV 1.8e
> > To unsubscribe, send a message to [log in to unmask]
> > with following text in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt or (re-start) delivery of
> > Technet send e-mail to
> > [log in to unmask]: SET Technet NOMAIL or (MAIL)
> > To receive ONE mailing per day of all the posts:
> > send e-mail to
> > [log in to unmask]: SET Technet Digest
> > Search the archives of previous posts at:
> > http://listserv.ipc.org/archives
> > Please visit IPC web site
> > http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for
> > additional information, or contact Keach Sasamori
> at
> > [log in to unmask] or
> > 847-615-7100 ext.2815
> >
>
-----------------------------------------------------
> >
> >
> ---------------------------------------------------
> > Technet Mail List provided as a service by IPC
> using
> > LISTSERV 1.8e
> > To unsubscribe, send a message to [log in to unmask]
> > with following text in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt or (re-start) delivery of
> > Technet send e-mail to [log in to unmask]: SET
> Technet
> > NOMAIL or (MAIL)
> > To receive ONE mailing per day of all the posts:
> > send e-mail to [log in to unmask]: SET Technet
> Digest
> > Search the archives of previous posts at:
> > http://listserv.ipc.org/archives
> > Please visit IPC web site
> > http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for
> > additional information, or contact Keach Sasamori
> at
> > [log in to unmask] or 847-615-7100 ext.2815
> >
>
-----------------------------------------------------
> >
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using
> LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask]
> with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of
> Technet send e-mail to [log in to unmask]: SET Technet
> NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts:
> send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
> additional information, or contact Keach Sasamori at
> [log in to unmask] or 847-615-7100 ext.2815
>
-----------------------------------------------------
>
>
>
>
>
---------------------------------------------------------------------
> This transmission (including any attachments) may
> contain confidential information, privileged
> material (including material protected by the
> solicitor-client or other applicable privileges), or
> constitute
=== message truncated ===
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute non-public
information. Any use of this information by anyone other than the intended
recipient is prohibited. If you have received this transmission in error,
please immediately reply to the sender and delete this information from your
system. Use, dissemination, distribution, or reproduction of this
transmission by unintended recipients is not authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
_____
Do you Yahoo!?
Yahoo! Small Business - Try
<http://us.rd.yahoo.com/evt=31637/*http://smallbusiness.yahoo.com/resources/
> our new resources site!
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
