Preparing the IMS Industry for Lead Free and Future Technologies, Meeting the Challenges - What Stays, What Changes

April 26-27, 2005 * Manchester, NH

Designing printed boards is more difficult today than ever, the density of electronic interconnection has increased. And, there are changes as to what materials are considered hazardous along with new recycling requirements. The European Union (EU) Directives have caused suppliers to rethink their materials and processes. These directives will not permit certain materials to be used after mid 2006, affecting everyone who designs or produces electronics. 

Component manufacturers will have to change the plating on leads, lands, balls and the plastic housing. Surface finishes on the mounting surface of the printed board are no longer as robust as they were. And, since the alternatives require increased temperature exposure, the printed board dielectric, the component plastic, and other features have to be re-evaluated. 

Attendees will better understand these alternatives and will learn more about lead free assembly. Increasingly sophisticated PCB fabrication technologies and ways to cope with the new materials and performance requirements will be covered. Topics include managing the interconnection of both through hole and surface mount on bare boards as well as tolerance characteristics and design in today's manufacturing equipment. 

For a full course description and to register, go to http://www.ipc.org/calendar/dfmIMS_42605/IMSLF_42605.htm or contact Michelle Michelotti at 847-597-2822.

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