Fellow TechNetters:

   -  Does DIG Plating require a nickel barrier metal plating?
   -  Does DIG Plating thin, etch, out the copper pad?
   -  Does the step down region, etched, become critical?
   -  Does the step down region have a criteria for acceptance?

In a previous like I witness BGA failures at the step down region on the
copper pad.
A foil fractures occurred at the edge of the solder mask and the step
down region of the copper pad.

Any input from personal experiences will greatly be appreciated.

Victor,


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