Hi Phil:
There are two lands, one source and one destination. The source land for class two needs to be covered 75% and the destination 0%. Circumferential coverage (fillet and wetting ) of lead and barrel source side 270% and destination 180%. Vertical fill 75%. It seems that the barrel fill for the boards in question do not have sufficient fill.
In more simple terms:
The solder has to wet the bottom *land* and lead 3/4 of it,
the top *land* and lead 0%,
wet the *barrel* and lead 3/4 of the bottom side of the barrel,
only 1/2, 3/4 of the way up.
So if it was taken out it would look like a cylinder that has part of one side cut at an angle so that is wider at the bottom and narrower at the top.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Bavaro
Sent: Thursday, March 31, 2005 6:44 PM
To: [log in to unmask]
Subject: Re: [TN] PTH Hole Fill (old subject, new question) 3rd try
Here is my question regarding Class 2 Requirements for handsoldering of a
Thru hole Battery Lead in a 6 layer (ground plane containing) PWB:
Topside visual inspection reveals the destination side pad is still gold
because the hole is only filled about 50%.
At what height does the 180 degree wetting requirement on the destination
side apply (inside the barrel or at the top of the barrel)?
Does the 0 percent requirement for pad wetting on the destination side
mean that the barrel only has to be filled halfway and only wet to both
barrel and lead halfway around the circumference?
I always had thought it meant the weak knee had to be wetted with solder
halfway around the circumference of the hole on the destination side!
If this were in-house, I would have no problems rejecting it but since this
is sub-contractor work, I need the official definition.
Thanks in advance.
Phil
ps: Sorry if this posts three times, seems I had the wrong email address.....
At 01:16 PM 5/30/2003, Steve Gregory wrote:
>Hi Bev!
>
>The minimum vertical hole fill is defined as follows:
>
>Class 1: Not specified, with a 270-degree circumferential fillet and
>wetting on the secondary (solder source side) of lead and barrel, and a
>75% coverage of the land area on the secondary side.
>
>Class 2: 75% fill, with a 270-degree circumferential fillet and wetting on
>the secondary (solder source side) of lead and barrel, and a 75% coverage
>of the land area on the secondary side.
>
>Class 3: 75% fill,ith a 330-degree circumferential fillet and wetting on
>the secondary (solder source side) of lead and barrel, and a 75% coverage
>of the land area on the secondary side.
>
>You can go down to a 50% vertical fill, with 360-degree fill around the
>lead with 100% wetting from the barrel to the lead on the solder source
>side, for class 1 & 2, but not for class 3...and that's when there are
>thermal planes connected to the barrel and act as heat sinks.
>
>Then there's the statement in certain situations, less than 100% may not
>be acceptable.
>
>No "there was a relaxation of solder fill when and if the lead of the
>component was not sufficiently large enough compared to the PTH to which
>it was soldered". statement anywhere in the -610 that I can read...
>
>-Steve Gregory-
>
>
>>Technetters,
>>Someone in our company is quite sure "there was a relaxation of solder
>>fill when and if the lead of the component was not sufficiently large
>>enough compared to the PTH to which it was soldered". I have no
>>recollection of such a change in A610. But the maybe some of my brain
>>cells are on vacation. Can anyone comment on the statement about hole
>>fill, please? Thanks.
>>
>>Bev Christian
>>Research in Motion
>
>
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