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April 2005

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Subject:
From:
Brummer Chuck <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brummer Chuck <[log in to unmask]>
Date:
Tue, 5 Apr 2005 08:40:46 -0700
Content-Type:
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Steve,

If this was a print and etch job like inner layers I would be saying "holy
resist failure Batman" and would have suspected that your suppliers resist
had a run of bubbles or loss of adhesion areas as some of the failures are
called "etch downs".  Since the resist on an outer layer is the tin lead or
tin then one has to suspect that some contaminant, usually resist residue,
prevented the plating.  Interesting that etch out areas are so round, still
looks like bubbles.  Rudy, Hydrogen evolution or bubbles?

Chuck

-----Original Message-----
From: Stephen Gregory [mailto:[log in to unmask]]
Sent: Tuesday, April 05, 2005 6:45 AM
To: [log in to unmask]
Subject: [TN] Mousebites...


Mornin' all ya'll!

Came back in this morning and looked at the fabs that I posted about
yesterday some more. We're going to reject them.

Not just because of the mousebites on the annular pads, but we've
discovered that there are mousebites all over everything. In some
cases reducing the trace widths.

Take a look at; "Mousebites 1-4" at:   http://www.stevezeva.homestead.com
If it were just the annular pads, we might have accepted them. But not with
them occuring all over the fab like this.

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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