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April 2005

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Wed, 27 Apr 2005 07:14:42 -0400
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If you stick with ENIG and do not test Immersion Silver then I am sure
you will be doing future testing to combat the issues with ENIG.  Monies
are being put into the development if silver and several toughed
formulas are coming out that have excellent resistance to TC and do not
have the issues associated with ENIG.  OSP is also seeing some
development, but I do not see this as a viable alternative today.

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: Bob Arciolla [mailto:[log in to unmask]] 
Sent: Tuesday, April 26, 2005 4:41 PM
To: [log in to unmask]
Subject: [TN] gold vs copper plating on pcb's

Good Afternoon all,

Our company will be switching over to lead free and we have received
sample pcb's from one of our vendors and one board has gold (ENIG) for
the traces and one has copper (OSP). From some of the emails I have seen
on Technet it appears that gold is what most of companies are going to
be using? Is this correct or is there some other materials we should be
looking into to use? Is the gold more reliable than the copper?
Any input would be greatly appreciated.


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Regards, Bob

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