TECHNET Archives

April 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Edward Szpruch <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Edward Szpruch <[log in to unmask]>
Date:
Wed, 27 Apr 2005 10:13:47 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (238 lines)
This phenomena was reported by one of ENIG chemistry suppliers as problem
only in Far East in areas with very high air pollution.
I do not know Mr. Nielsson, but the obvious question is if such problem was
defined geographically or it  was found as worldwide.
Edward

Edward Szpruch
Eltek Ltd
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel  ++972 3 9395050 , Fax  ++972 3 9309581
e-mail   [log in to unmask]
web site : www.eltekglobal.com

> -----Original Message-----
> From: Tegehall Per-Erik [SMTP:[log in to unmask]]
> Sent: ã àôøéì 27 2005 8:49
> To:   [log in to unmask]
> Subject:      Re: [TN] ENIG vs Hard Gold
> 
> Claus Würtz Nielsson from Nokia Mobile Phones published a paper at the
> IMAPS Nordic Conference last year entitled "The evolution of surface
> finishes in mobile phone applications". He reported that they have had
> corrosion problems with ENIG coated key pads. By using a new formulation
> of the ENIG process (higher P content and less porous Au coating) the
> corrosion stability was improved. Nevertheless, he concluded that "It
> becomes more and more clear that the thin ENIG in the future not will be
> able to address the need for higher wear resistance in the extreme part of
> the product segments as gaming devices and phones used by workmen or
> during sporting activities".
> 
> Per-Erik Tegehall
> IVF
> 
> -----Ursprungligt meddelande-----
> Från: Gerard O'Brien [mailto:[log in to unmask]]
> Skickat: den 25 april 2005 15:33
> Till: [log in to unmask]
> Ämne: Re: [TN] ENIG vs Hard Gold
> 
> 
> The POINT of this test was to examine if the use of ENIG as a switch
> membrane interface was viable. The testing was performed to industry
> protocol. There were no additional stress conditions  and multiple
> suppliers
> were tested. Of course if you are going to use ENIG as a switch pad
> interface metal in a corrosive environment or under water you may have
> some
> slight issues - not least of which is the operator pushing the button.
> Bottom line form the test was that for NORMAL use environments, such as
> cell
> phones, radio's etc, the surface passed with flying colors - read the
> document.
> 
> 
> 
> 
> -----Original Message-----
> From: David Douthit [mailto:[log in to unmask]]
> Sent: Monday, April 25, 2005 7:54 AM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG vs Hard Gold
> 
> Victor,
> 
> Not so great info!! This info can not be accurately correlated to "in
> service " use because it does not take into account environmental
> conditions. Temperature, humidity, contamination (airborne and other
> forms) vibration and various combinations will drastically alter the
> "life" of the key pads.
> 
> This test can give a false feeling of security!
> 
> David A. Douthit
> Manager
> LoCan LLC
> 
> Victor G. Hernandez wrote:
> 
> >Great info!   What is the 1.5 million cycles equate to in usage time.
> >
> >Victor,
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerard O'Brien
> >Sent: Monday, April 25, 2005 7:14 AM
> >To: [log in to unmask]
> >Subject: Re: [TN] ENIG vs Hard Gold
> >
> >Alistair - as part of the 4552 specification testing, we ran ENIG at 2
> >microinches for 1.5 million cycles for a keypad type application. We
> >stopped
> >because the membrane was breaking down  but not the ENIG surface. The
> >data
> >can be found in the tech paper that is in the appendix of IPC-4552
> >
> >Regards
> >
> >
> >Gerard O'Brien
> >Photocircuits Corporation
> >Co-chairman 4-14
> >
> >-----Original Message-----
> >From: Alistair Murray [mailto:[log in to unmask]]
> >Sent: Monday, April 25, 2005 6:51 AM
> >To: [log in to unmask]
> >Subject: [TN] ENIG vs Hard Gold
> >
> >Hi to everyone,
> >
> >Could someone please let me know or indicate where I can obtain
> >information on the relative performances of ENIG and Hard Gold in
> >keyboard applications?
> >
> >
> >
> >Many thanks in anticipation.
> >
> >
> >
> >
> >
> >
> >
> >Alistair Murray
> >
> >Artetch Circuits Ltd
> >
> >UK
> >
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> >To unsubscribe, send a message to [log in to unmask] with following text
> >in
> >the BODY (NOT the subject field): SIGNOFF Technet
> >To temporarily halt or (re-start) delivery of Technet send e-mail to
> >[log in to unmask]: SET Technet NOMAIL or (MAIL)
> >To receive ONE mailing per day of all the posts: send e-mail to
> >[log in to unmask]: SET Technet Digest
> >Search the archives of previous posts at:
> >http://listserv.ipc.org/archives
> >Please visit IPC web site
> >http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >for additional information, or contact Keach Sasamori at [log in to unmask]
> >or
> >847-615-7100 ext.2815
> >-----------------------------------------------------
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> >To unsubscribe, send a message to [log in to unmask] with following text
> >in
> >the BODY (NOT the subject field): SIGNOFF Technet
> >To temporarily halt or (re-start) delivery of Technet send e-mail to
> >[log in to unmask]: SET Technet NOMAIL or (MAIL)
> >To receive ONE mailing per day of all the posts: send e-mail to
> >[log in to unmask]: SET Technet Digest
> >Search the archives of previous posts at:
> >http://listserv.ipc.org/archives
> >Please visit IPC web site
> >http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
> >information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
> >ext.2815
> >-----------------------------------------------------
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> >To unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet
> >To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> >To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> >Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> >Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> >-----------------------------------------------------
> >
> >
> >
> >
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2