TECHNET Archives

April 2005

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Immersion Silver
From:
"Stephen M. Vargas" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stephen M. Vargas
Date:
Fri, 1 Apr 2005 07:42:26 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Good Day All:

    A question arose at our factory regarding immersion silver surface
finish. We recieved boards where the solder masking was applied after the
immersion silver was applied to the PWB. Are there potential solder mask
adhesion issues with this? Should the solder mask be applied prior to
adding the surface finish? Any insight would be appreciated. Thanks.

Regards,
Steve Vargas

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2