Victor,
What features do you want to etch it for?
Vladimir
Sent from my Blackberry Wireless
Vladimir Igoshev, 519-888-7465 ext.5283
-----Original Message-----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Apr 26 09:42:48 2005
Subject: Re: [TN] Lead Free, Ball Grid Array, solder bump cross section
George,
I did resolve my polishing artifact issue. It was all in the water
/IPA rinse.
Do you know of a chemical etchant for LF solder?
Thanks for you input.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Monday, April 25, 2005 4:04 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free, Ball Grid Array, solder bump cross section
Victor,
We use MasterPrep all the time and don't see the problem you are
referring to. As Wade indicated if there is separation between your
sample and mounting material, or for that matter if you have lots of
voids in the solder joints you will trap water and polishing compound in
the separation or voids that well come out slowing and mess you nicely
polished surface up.
Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of McFaddin, Wade
Sent: Monday, April 25, 2005 4:51 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free, Ball Grid Array, solder bump cross section
Hi Victor,
We use a colloidal silica solution (0.05 micron) for our final polish.
We
polish for about one and a half minutes, with the final half minute
running
water on the cloth (Buehler's micro-cloth) and cross-section. This
cleans
the cloth and the cross-section mount of the colloidal solution. We then
rinse just the cross-section mount again with water and then quickly
rinse
with alcohol (IPA) and blow dry with nitrogen and wipe lightly with a
cotton
ball. This usually gives us a clean, stain free surface. However, if
you
have pull-away (separation) of your mounting epoxy to the sample
surface, it
can be very difficult to get all the water and polishing solution out of
the
separation area.
Hope this helps.
Wade McFaddin
Nextek Inc.
-----Original Message-----
From: Victor G. Hernandez [mailto:[log in to unmask]]
Sent: Monday, April 25, 2005 1:48 PM
To: [log in to unmask]
Subject: [TN] Lead Free, Ball Grid Array, solder bump cross section
Fellow TechNetters:
I have conducted many of LF solder bump cross section and final
polish is conducted with a Buehler Masterprep
Polishing Suspension Alumina 0.05 microns. Micro craves, epoxy
shrinkage/voids, on the sample surface retain
the polishing compound which contaminate the surface appearance. This
step can cause staining and/or water
marks on the bulb solder prior to mid range magnification examination
with inverted stage microscope.
Can some one recommend a LF chemical etchant that I can replace the
alumina step in my process?
Victor,
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