This will be performed with a datapak instrument, I was told the pcb
temp would mirror the set-point by our manufacturing team!
Would it be a safe move to slow the conveyor down until the datapak is
run through the reflow,
Regards,
Jason
-----Original Message-----
From: Anderson, Greg (GE Infrastructure)
[mailto:[log in to unmask]]
Sent: April 25, 2005 2:49 PM
To: TechNet E-Mail Forum; Jason Larson
Subject: RE: [TN] Solder reflow
Jason,
I believe that the Omniflo 7 has around 98-100" total heated length. At
35" per minute conveyor speed, you are cannot be much longer than 2.8
minutes in the heated zones. Depending on how effective your cooling
zones are working, you may have a relatively short and "cool" profile.
Even if your joints are getting to 203 deg C, I wonder if they are above
liquidous long enough the actually "meld" the joints.
You say the recipe and computer screen show the peak temperature is
"240". It sounds like you are reading the SETPOINT of he oven, rather
than what the solder joints achieve.
Have you run a reflow profile with themocouples on/in the joints in
question to determine their actual temperature?
Greg Anderson
Senior Advanced Manufacturing Engineer
GE Fanuc Automation
P.O. Box 8106
2500 Austin Drive
Charlottesville, VA 22911
434-978-5181
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jason Larson
Sent: Monday, April 25, 2005 5:33 PM
To: [log in to unmask]
Subject: Re: [TN] Solder reflow
Steve, thanks for posting the pictures,
According to the recipe and computer screen at the reflow, the peak
temperature is 240, the machine in use is a Electrovert Omniflo 7E
Profile is as follows
130 150 160 165 165 210 240 Rate is 35"/min
As far as contamination, the poor solder is not limited to one
particular component, also if I use a hand iron "correctly" then the
component does not pull off the pcb.
Thanks,
Jason
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: April 25, 2005 1:34 PM
To: TechNet E-Mail Forum; Jason Larson
Cc: [log in to unmask]
Subject: Re: [TN] Solder reflow
Hi Jason!
I got the pictures you sent to me posted up on my web page for everyone
to take a look at. Go to: http://www.stevezeva.homestead.com
and look at "Swiss Cheese Solder, and Swiss Cheese Solder 2".
What it looks like to me is that either the component had contamination
on the leads and didn't allow the solder to wet, or that the solder
wasn't liquidous long enough to form the metallurgical bond, or allow
all the voids to work themselves out of the joint...I see a lot of voids
in the solder.
Do you know what your peak temperature was during reflow, and how long
did it stay above liquidous?
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
|---------+---------------------------->
| | Jason |
| | <jlarson@PACIFICI|
| | NSIGHT.COM> |
| | Sent by: TechNet |
| | <[log in to unmask]>|
| | |
| | |
| | 04/25/2005 02:38 |
| | PM |
| | Please respond to|
| | TechNet E-Mail |
| | Forum; Please |
| | respond to Jason |
| | |
|---------+---------------------------->
>-----------------------------------------------------------------------
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|
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| To: [log in to unmask]
|
| cc:
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| Subject: [TN] Solder reflow
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Good day,
investigation into solder reflow performance reveals components that
pull out of the solder fillet with no damage to the component and the
fillet is left intact as well. Solder that was under the component looks
like swiss cheese with multiple holes. What part of the reflow is the
likely cause, conveyor speed, pre-heat, reflow heat, or cool down?
Thanks in advance for any help
Jason
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