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April 2005

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Subject:
Solder reflow
From:
Jason <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jason <[log in to unmask]>
Date:
Mon, 25 Apr 2005 14:38:22 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Good day,
investigation into solder reflow performance reveals components that pull
out of the solder fillet with no damage to the component and the fillet is
left intact as well. Solder that was under the component looks like swiss
cheese with multiple holes.
What part of the reflow is the likely cause, conveyor speed, pre-heat,
reflow heat, or cool down?

Thanks in advance for any help
Jason

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