Hello Victor,
I use 1 micron diamond suspension (for a "final touch") and it has always worked for me.
Vladimir
Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
Sent: Monday, April 25, 2005 2:48 PM
To: [log in to unmask]
Subject: [TN] Lead Free, Ball Grid Array, solder bump cross section
Fellow TechNetters:
I have conducted many of LF solder bump cross section and final
polish is conducted with a Buehler Masterprep
Polishing Suspension Alumina 0.05 microns. Micro craves, epoxy
shrinkage/voids, on the sample surface retain
the polishing compound which contaminate the surface appearance. This
step can cause staining and/or water
marks on the bulb solder prior to mid range magnification examination
with inverted stage microscope.
Can some one recommend a LF chemical etchant that I can replace the
alumina step in my process?
Victor,
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