Fellow TechNetters:

   I have conducted many of LF solder bump cross section and final
polish is conducted with a Buehler Masterprep

Polishing Suspension Alumina 0.05 microns.   Micro craves, epoxy
shrinkage/voids, on the sample surface retain

the polishing compound which contaminate the surface appearance.   This
step can cause staining and/or water

marks on the bulb solder prior to mid range magnification examination
with inverted stage microscope.

   Can some one recommend a LF chemical etchant that I can replace the
alumina step in my process? 

Victor,

 


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