Well then let's consider the description is foil to plating and not
something else.....
The failure mechanism of dep or plating to foil indicated a broad issue
in the interface where you are seeing the failure. Understanding if the
failure is dep to foil of plate to dep will provide the guidance into
where to look in your process for the problem. Without understanding
where the failure is occurring your efforts will not be affective.
Microsection samples that are properly taken, prepared and etched will
provide the information needed to direct the resolution. It is true
many PCB shops do not have adequate facilities to perform these tests
and in these cases I would suggest outsourcing to a lab that has the
technology needed.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: Franklin D Asbell [mailto:[log in to unmask]]
Sent: Thursday, April 21, 2005 9:35 AM
To: [log in to unmask]
Subject: Re: [TN] Peeling Copper traces
I would think his comment "pulling away from the foil" would rule out
the
need for peel strength test. I've never seen conditions that have caused
plated copper peeling show up in microsection, of course I've never
viewed
them over 200X...and it's been my experience angstroms thick passivation
contaminates are not viewable in most in-house labs.
Where I would begin is water break on the foil panels before and after
electroless copper, perhaps experiments involving cleaning and microetch
to
determine where (on raw foil surface, or during/post electroless copper)
the
condition is occuring.
Franklin
----- Original Message -----
From: "Jeffrey Bush" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, April 21, 2005 7:51 AM
Subject: Re: [TN] Peeling Copper traces
If the failure is plating to foil you will need to do a microsection to
identify the failure mechanism - foil to dep, dep to plate, etc. If the
failure is foil to base material you will need to assess that raw
material lot for peel-strength.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: Rich Olsen [mailto:[log in to unmask]]
Sent: Wednesday, April 20, 2005 4:51 PM
To: [log in to unmask]
Subject: [TN] Peeling Copper traces
Hello,
What are some likely causes of peeling copper traces?
It is plated copper pulling away from the foil copper?
thanks,
Rich
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