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April 2005

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Subject:
From:
"Barmuta, Mike" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Barmuta, Mike
Date:
Thu, 21 Apr 2005 08:50:00 -0700
Content-Type:
text/plain
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text/plain (65 lines)
Rob: I don't have a contact but if you are going with the concentrated
sulfuric acid(>96%)be sure they are using a post sulfuric dip oxidizer to
remove the residual solvated epoxy, typically potassium
permanganate/caustic(KMn04/NaOH). Without it you risk holewall pullaway due
to weak bonding sites for subsequent catalyzation and electroless Cu
deposition.

                                                                Regards

Michael Barmuta

Staff Engineer

Fluke Corp.

Everett WA

425-446-6076

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Robert Coburn
Sent: Thursday, April 21, 2005 5:55 AM
To: [log in to unmask]
Subject: [TN] Concentrated Sulfuric etchback


Hi T'Netters:

One of our divisions has a design that requires positive etchback on a four
layer PCB (FR4 resin system).
The board shop that had previously provided these boards subcontracted to a
Plasma service.
The etchback does not meet requirements.

Does anyone have a contact that can provide a concentrated Sulfuric acid,
Ammonium Biflouride etchback?

TIA,
Regards,
Rob

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