Dear all
While we are on this subject .  I have noticed a few shops still use the
Microplate line to plate tabs.

These lines have both a soft gold strike followed by a hard gold

How much of gold are we applying on such lines?

The boards have to be taped (masked) and we still get the some chemicals
getting under the barrier and attacking the mask.  
What causes this?  I was told it is the peroxide based stripper used to
remove the Sn/Pb or Sn

Thanking you


-----Original Message-----
From: Valerie St.Cyr [mailto:[log in to unmask]] 
Sent: Wednesday, April 20, 2005 12:16 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG vs Flash Gold

No, the immersion gold in the ENIG process is a self-limiting deposit
and
will be 3 - 8 microinches; the thickness of the plated gold in the
electrolytic process will be much harder to control; we spec 3 - 15
microinches (and sometimes get pushback). As Jeff said, it is the nature
of the beast for a electrolytic-plated process to have deposit
variability
based on circuit density (and tank design; and anodes; etc and so
forth).

"Flash" is normally used to mean a thin, sacrificial coating of
*plated*
hard gold.

Valerie






John Parsons <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
04/19/2005 05:12 PM
Please respond to TechNet E-Mail Forum; Please respond to John Parsons


        To:     [log in to unmask]
        cc:
        Subject:        Re: [TN] ENIG vs Flash Gold


Sure, understood.  I should be able to hold them to similar Ni and Au
thickness specs as for ENIG no?

John Parsons

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha
Sent: Tuesday, April 19, 2005 2:07 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG vs Flash Gold

Flash gold is too general of a term. If you are to solder to the thinner
gold successfully it must be less than 20 uin.
-- Thanks,
Eddie Rocha
South Bay Circuits
(480) 940-3125 x122

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