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April 2005

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Date:
Thu, 21 Apr 2005 06:57:28 -0400
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Technetters:

On a large board (16" x 20"), some optofet relays (4-pin SMT SSOP4
package) are being "knocked off" during post-reflow assembly, handling,
cleaning, or ??.

The relays are located on both sides of the board.  We mount temporary
standoffs on the board (during some of the manual assembly whenever
possible) to protect these and other parts, and have reduced the problem,
but would like to eliminate the problem.

Here's a link to manufacturers website to view the part:
http://www.aromat.com/pcsd/product/pmos/pdf_cat/aqy221n2v.pdf#search='aqy221n2vy'

We've added glue (chip bonder) dots to each side of the relay before
placement, but that may (or seems to) be lifting the part slightly causing
poor solder contact.


Some questions:

Are there IPC or industry specs. on the shear force a component should be
able to handle?

Would a post-reflow underfill work (the underside clearance is the height
of the solder, maybe about .003")?

Are other users of this part experiencing the same problem?


As usual, thanks in advance for your responses,


Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
500 Riverpark Drive
Mail Stop NR500 1-1
North Reading, MA 01864
Tel: 978-370-1726

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