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April 2005

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Subject:
From:
"Valerie St.Cyr" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 20 Apr 2005 12:15:31 -0400
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No, the immersion gold in the ENIG process is a self-limiting deposit and
will be 3 - 8 microinches; the thickness of the plated gold in the
electrolytic process will be much harder to control; we spec 3 - 15
microinches (and sometimes get pushback). As Jeff said, it is the nature
of the beast for a electrolytic-plated process to have deposit variability
based on circuit density (and tank design; and anodes; etc and so forth).

"Flash" is normally used to mean a thin, sacrificial coating of  *plated*
hard gold.

Valerie






John Parsons <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
04/19/2005 05:12 PM
Please respond to TechNet E-Mail Forum; Please respond to John Parsons


        To:     [log in to unmask]
        cc:
        Subject:        Re: [TN] ENIG vs Flash Gold


Sure, understood.  I should be able to hold them to similar Ni and Au
thickness specs as for ENIG no?

John Parsons

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha
Sent: Tuesday, April 19, 2005 2:07 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG vs Flash Gold

Flash gold is too general of a term. If you are to solder to the thinner
gold successfully it must be less than 20 uin.
-- Thanks,
Eddie Rocha
South Bay Circuits
(480) 940-3125 x122

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