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April 2005

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Mon, 4 Apr 2005 11:24:38 -0400
Content-Type:
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text/plain (175 lines)
Ted

I would clean them with  a strong water soluble flux to hopefully remove the intermetallic and then if possible solder dip them to provide a solderable surface. If that is not practical,  I would apply the solder paste immediately after cleaning.

Good luck

Lee  
  ----- Original Message ----- 
  From: Ted Tontis<mailto:[log in to unmask]> 
  To: TechNet E-Mail Forum<mailto:[log in to unmask]> ; Lee parker<mailto:[log in to unmask]> 
  Sent: Monday, April 04, 2005 10:57 AM
  Subject: RE: [TN] Immersion Silver


  If that where the case how would you go about getting those
  joints to reflow. I ask because we have some boards that look as you
  describe and solder just as you describe, our AOI machine is spitting
  them out like crazy. 

  Regards,
  Ted

  -----Original Message-----
  From: Lee parker [mailto:[log in to unmask]] 
  Sent: Monday, April 04, 2005 8:50 AM
  To: [log in to unmask]<mailto:[log in to unmask]>
  Subject: Re: [TN] Immersion Silver

  Kaye

  Are you sure it is silver? Immersion silver is normally applied after
  soldermask. What What you are seeing may be the tin that was used as an
  etch resist and not completely removed. If this is the case these boards
  will be difficult to solder.

  Best regards

  Lee
    ----- Original Message ----- 
    From: Kaye Clayo<mailto:[log in to unmask]<mailto:[log in to unmask]>> 
    To: [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]>> 
    Sent: Friday, April 01, 2005 2:27 PM
    Subject: Re: [TN] Immersion Silver


    From all that I have read, the immersion silver finish should be
    the very last process step before drying & packaging.

    Kaye

    At 08:42 AM 4/1/2005, you wrote:
    >Good Day All:
    >
    >    A question arose at our factory regarding immersion silver
  surface
    >finish. We recieved boards where the solder masking was applied after
  the
    >immersion silver was applied to the PWB. Are there potential solder
  mask
    >adhesion issues with this? Should the solder mask be applied prior to
    >adding the surface finish? Any insight would be appreciated. Thanks.
    >
    >Regards,
    >Steve Vargas
    >
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