If that where the case how would you go about getting those
joints to reflow. I ask because we have some boards that look as you
describe and solder just as you describe, our AOI machine is spitting
them out like crazy.
Regards,
Ted
-----Original Message-----
From: Lee parker [mailto:[log in to unmask]]
Sent: Monday, April 04, 2005 8:50 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion Silver
Kaye
Are you sure it is silver? Immersion silver is normally applied after
soldermask. What What you are seeing may be the tin that was used as an
etch resist and not completely removed. If this is the case these boards
will be difficult to solder.
Best regards
Lee
----- Original Message -----
From: Kaye Clayo<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Friday, April 01, 2005 2:27 PM
Subject: Re: [TN] Immersion Silver
From all that I have read, the immersion silver finish should be
the very last process step before drying & packaging.
Kaye
At 08:42 AM 4/1/2005, you wrote:
>Good Day All:
>
> A question arose at our factory regarding immersion silver
surface
>finish. We recieved boards where the solder masking was applied after
the
>immersion silver was applied to the PWB. Are there potential solder
mask
>adhesion issues with this? Should the solder mask be applied prior to
>adding the surface finish? Any insight would be appreciated. Thanks.
>
>Regards,
>Steve Vargas
>
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