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April 2005

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Subject:
From:
Charles Caswell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Charles Caswell <[log in to unmask]>
Date:
Mon, 18 Apr 2005 14:24:16 -0500
Content-Type:
text/plain
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text/plain (71 lines)
There are manuf. Of ultrasonic cleaning equipment that use a sweeped freq.
which is supposed to eliminate the resonance problem. I would search the
archives.

-----Original Message-----
From: Blair K. Hogg [mailto:[log in to unmask]] 
Sent: Monday, 18 April 2005 9:39 AM
To: [log in to unmask]
Subject: Re: [TN] Ultrasonics

At a former employer we used resistor divider networks which had stamped
leads soldered to the component. The component was made from resistive ink
which was sliced in a serpentine pattern to create a high resistance. The
legs of the device had three prongs that would straddle the device in an
offset pattern. The manufacturer ultrasonically cleaned the parts after
soldering, which caused the stress areas in the stamped legs to develop
cracks and fail at a later date. Once the U/S cleaning was eliminated, the
problem disappeared.

Blair

>>> [log in to unmask] 04/18/05 09:15AM >>>
Technetters

I seem to remember somewhere that ultrasonics shouldn't be used to clean
populated PCB's. I have believed this to be due to damage inflicted to the
wire bonds within IC's and Xtals.

Is this the case can someone clarify what components (if any) cannot be
cleaned using ultrasonics?

Cheers

Mark


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