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April 2005

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Subject:
Re: Ultrasonics
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Mon, 18 Apr 2005 16:30:58 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (51 lines) 
Mark,
ask Dr. Tegehall at the IVF in Sweden. Ask him to get Bill Brox's
report on ultrasonic waves and their impact on bond wires and other
fragile parts...scaring pictures! I got the report myself, but too
bad quality for copying.

Hope Tegehall is reading this (he is at TN), I have lost his email adress...

Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]
Sent: den 18 april 2005 15:15
To: [log in to unmask]
Subject: [TN] Ultrasonics


Technetters

I seem to remember somewhere that ultrasonics shouldn't be used to clean
populated PCB's. I have believed this to be due to damage inflicted to the
wire bonds within IC's and Xtals.

Is this the case can someone clarify what components (if any) cannot be
cleaned using ultrasonics?

Cheers

Mark

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