Fellows,

I was just acknowledged by a PCB manufacturer that both ImAg and ImSn will be damaged if via holes are plugged (rather than tented). The ImAg will be corroded and the IMC layer of the ImSn will grow. As the plugging process (said he) is the very last process, both finishes will be Both will be polluted by the residues. His suggestion is to fill the vias before the external coating.

Did anyone meet the described problems?

Regards
Ofer Cohen
Manager
Quality Assurance, Reliability and Production Technologies
Seabridge Ltd. - A Siemens Company
Siemens COM FN A SB TQM

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