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April 2005

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Subject:
From:
Pete Lymn <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 4 Apr 2005 11:27:34 +0100
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text/plain
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In our experience co planarity is improved Scott.

-----Original Message-----
From: Scott Lefebvre [mailto:[log in to unmask]]
Sent: 01 April 2005 08:14 PM
To: [log in to unmask]
Subject: Re: [TN] Lead free solder HAL


Another question I have concerning Lead Free HASL process.  Current HASL
quality from our vendors has been excellent and the co planarity has been
very good as well.  If PCB shops switch there HASL process to Pb free, I
feel it will affect the co planarity of the solder finish, due to the
surface tension of the Pb fee solder and wetting characteristics.

Scott Lefebvre

-----Original Message-----
From: Russell Burdick [mailto:[log in to unmask]]
Sent: Thursday, March 31, 2005 4:24 AM
Subject: Re: Lead free solder HAL

There will always be the challenges of keeping things separated properly.
Board-wise in mfg I may have the 'luxury' of a second HAL machine and
separate rooms and preclean areas that will make it more difficult to
process in the wrong machine. Not imposible, but more difficult. Can't
eliminate someone with sheer determination or complete ignorance, but
perhaps slow them down enough to prevent disaster. Several places I've
worked recently have all kept the pure tin bars in a controlled area
compared to the solder bars on the floor to prevent a mix up.

Thanks for all the information everyone has provided. Like so many topics we
write/read about, now begins the real work.

Russ

>From: "Mcmaster, Michael" <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              "Mcmaster,
>Michael" <[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] Lead free solder HAL
>Date: Wed, 30 Mar 2005 12:50:30 -0800
>
>As far as I know, there is no universal lead-free solder being used.
>Won't there be complications with mixing alloys.
>
>The manufacturers of the solder leveling lines might like it but I can
>just see what happens when someone proposes we need to buy multiple
>lines to run different alloys.
>
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Pete Lymn
>Sent: Wednesday, March 30, 2005 7:06 AM
>To: [log in to unmask]
>Subject: Re: [TN] Lead free solder HAL
>
>Done correctly it looks just as bright as good SnPb Russ. The 'colour'
>is slightly different and varies a little with the alloy of choice.  In
>general you will find the maximum thicknesses (small features) will be
>thinner and the minimum thicknesses (ground areas) thicker. You tend
>not to see that 'air swept' look on earth plains. Hole clearing is
>better.
>   Done incorrectly its looks ugly! The operating window is narrower
>(your operating with very little super heat) As the copper content
>increases or the solder temperature drops the copper will separate from
>the tin leaving you with dull gritty dendritic deposits...
>
>  Nothing solders like solder. We have never had a board returned for
>solderability problems but we re process lots of other 'alternative'
>surface finishes.
>
>I don't see it Is a new process, its just a different alloy.
>
>-----Original Message-----
>From: Russell Burdick [mailto:[log in to unmask]]
>Sent: 30 March 2005 03:04 PM
>To: [log in to unmask]
>Subject: Re: [TN] Lead free solder HAL
>
>
>What should the surfaces cosmetically look like off the solder free HAL
>machine? Bright and shiny as our HASL? If not, what is the indicator
>that quality-wise the process is nearing the edge of acceptability?
>
>Are your customers well versed in the assembly of boards with the lead
>free solder finish? What types of solderability issues might I
>encounter if a customer has difficulty and "suspects" that it is a
>board problem compared to an assembly problem? (there is always a money
>aspect to every situation...)?
>
>I do understand that as a new process competing with an established one
>it will garner its own implementation issues. Operators could
>unwittingly apply the known guidelines of HASL and resist the new
>process as "not like the good old stuff".
>
>Russ
>
> >From: Pete Lymn <[log in to unmask]>
> >Reply-To: TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
> >To: [log in to unmask]
> >Subject: Re: [TN] Lead free solder HAL
> >Date: Wed, 30 Mar 2005 14:38:26 +0100
> >
> >We have been working with lead free alloys in HASL machines since '98
> >and have been leveling panels commercially for about 5 years. What
> >would you like to know?
> >
> >-----Original Message-----
> >From: Russell Burdick [mailto:[log in to unmask]]
> >Sent: 30 March 2005 01:19 PM
> >To: [log in to unmask]
> >Subject: [TN] Lead free solder HAL
> >
> >
> >Good Morning Technet,
> >
> >I am at the early stages of learning about lead free solder as an
> >alternative option to our current tin/lead solder HASL.
> >
> >Is there anyone out there who can comment about their experiences?
> >
> >Currently I have no customers requesting this process, but I need to
> >be ahead of this need when feasible.
> >
> >Vendors have provided both sides, yes PCB makers are doing it and a
> >large PCB maker tried it and discontinued using it.
> >
> >Thanks in advance.
> >
> >Russ Burdick, trying to lessen the HASL hassle
> >
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