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From:
- Bogert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, - Bogert <[log in to unmask]>
Date:
Sun, 3 Apr 2005 16:54:44 -0400
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April 3, 2005

Kester will no longer make HF-1189 flux since they can no longer get some of the chemicals that are used to make the flux.
  ----- Original Message ----- 
  From: Stephen Gregory<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Friday, April 01, 2005 11:59 AM
  Subject: Re: [TN] Heavy PCB Copper Wave Soldering...


  Hi Bill,

  I can't use a flux like HF-1189A since it is a ORH1 flux. The assembly
  is class-3, and according to J-STD-001 you're only to use L0 or L1 fluxes.

  I plan to flux the PTH liberally from the topside just before putting the
  board
  on to the conveyer. There's not a whole lot of through parts, just a lot of
  pins.
  The one big connector is a 300-pin connector, and then I have about 6
  header
  locations totaling around 60-pins.

  It may not be as bad as I'm worried about, the 20-ounce copper plane has
  been
  relieved from all the PTH's. It's main purpose in life is for conduction
  cooling. The
  SMT went pretty well. I did a double-sided reflow, and I'm using a
  selective wave
  solder pallet.

  I think the reflow went so well because the thick copper layers actually
  helped the
  PCB heat very evenly. My set-points for reflow weren't radically different
  except at
  the last few zones...my last three zones were set 200 C., 215 C., and 245
  C., upper
  and lower zones. The first 7 zones ramped-up in a ramp-to-spike type of
  profile.
  I have a OmniFlo-10. I did slow my belt speed down to 26-inches per minute
  from
  my normal 32-inches per minute that I use for most everything else.

  Kind regards,

  -Steve Gregory-
  Senior Process Engineer
  LaBarge Incorporated
  Tulsa, Oklahoma
  (918) 459-2285
  (918) 459-2350 FAX


  |---------+---------------------------->
  |         |           Bill Kasprzak    |
  |         |           <[log in to unmask]<mailto:[log in to unmask]>|
  |         |           OM>              |
  |         |           Sent by: TechNet |
  |         |           <[log in to unmask]<mailto:[log in to unmask]>>|
  |         |                            |
  |         |                            |
  |         |           04/01/2005 09:13 |
  |         |           AM               |
  |         |           Please respond to|
  |         |           TechNet E-Mail   |
  |         |           Forum; Please    |
  |         |           respond to       |
  |         |           bkasprzak        |
  |         |                            |
  |---------+---------------------------->
    >--------------------------------------------------------------------------------------------------------------|
    |                                                                                                              |
    |       To:       [log in to unmask]<mailto:[log in to unmask]>                                                                              |
    |       cc:                                                                                                    |
    |       Subject:  Re: [TN] Heavy PCB Copper Wave Soldering...                                                  |
    >--------------------------------------------------------------------------------------------------------------|




  Steve,

  My approach on a board like this might include the use of a water based
  water soluble flux like, HF-1189A. This way you can preheat your board in
  an oven prior to wave then still apply flux without vaporizing it.

  It'll be interesting to see how you handled these monsters. Keep us
  posted. Good luck.

  Bill Kasprzak
  Moog Inc
  Process Engineer, Electronic Assembly



  Stephen Gregory <[log in to unmask]<mailto:[log in to unmask]>>
  Sent by: TechNet <[log in to unmask]<mailto:[log in to unmask]>>
  03/31/2005 05:41 PM
  Please respond to
  TechNet E-Mail Forum <[log in to unmask]<mailto:[log in to unmask]>>; Please respond to
  [log in to unmask]<mailto:[log in to unmask]>


  To
  [log in to unmask]<mailto:[log in to unmask]>
  cc

  Subject
  [TN] Heavy PCB Copper Wave Soldering...






  Hi Ya'll!!

  I just thought I'd share what is going to make things a little
  more interesting for me here at work over the next couple
  of days...

  Go to: http://www.stevezeva.homestead.com<http://www.stevezeva.homestead.com/> and look at;
  "Heavy Metal", Heavy Metal 2, and Heavy Metal 3. This
  an assembly that I will be wave soldering, that has two 20-ounce
  layers of copper on layers 2 and 11 (this is a 12-layer board).

  I may be asking for some help for this...

  My first try is to preheat and bake the assembly in a oven close
  to the wave solder machine at 150 C., and then quickly remove
  it from the oven, get it into the wave as soon as I can before it has
  a chance to cool down, and see what kind of barrel fill I get.

  I'll let you all know if this works, or I may be asking for some
  help...

  Kind regards,

  -Steve Gregory-
  Senior Process Engineer
  LaBarge Incorporated
  Tulsa, Oklahoma
  (918) 459-2285
  (918) 459-2350 FAX
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  __________________________________________________________________
  This message may contain information that is privileged and confidential to
  LaBarge, Inc.  It is for use only by the individual or entity named above.
  If you are not the intended recipient, you may not copy, use or deliver
  this message to anyone.  In such event, you should destroy the message and
  kindly notify the sender by reply e-mail.

  ---------------------------------------------------
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  To unsubscribe, send a message to [log in to unmask]<mailto:[log in to unmask]> with following text in
  the BODY (NOT the subject field): SIGNOFF Technet
  To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]<mailto:[log in to unmask]>: SET Technet NOMAIL or (MAIL)
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  Search the archives of previous posts at: http://listserv.ipc.org/archives<http://listserv.ipc.org/archives>
  Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16<http://www.ipc.org/contentpage.asp?Pageid=4.3.16> for additional information, or contact Keach Sasamori at [log in to unmask]<mailto:[log in to unmask]> or 847-615-7100 ext.2815
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